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O2 Vacuum Plasma Cleaning Machine: A Breakthrough in Surface Technology
The O2 Vacuum Plasma Cleaning Machine is rapidly becoming the gold standard in high-tech manufacturing processes. With its molecular-level cleaning capability and superior surface activation performance, this system effectively solves adhesion, coating, and component packaging challenges—without damaging the base material.
1. What Is an O2 Vacuum Plasma Cleaning Machine?
An O2 Vacuum Plasma Cleaning Machine is a system that uses oxygen gas as the primary reactive gas under low-pressure (vacuum) conditions. When energized by electromagnetic power, oxygen molecules are ionized to generate highly reactive oxygen radicals. These radicals aggressively break down organic contaminants, converting them into volatile compounds such as CO₂ and H₂O.
The result is a perfectly clean surface enriched with active functional groups, significantly increasing surface energy and improving bonding performance.
2. System Technical Specifications
| Item | Specification | Item | Specification |
|---|---|---|---|
| Overall dimensions | 760W × 1435H × 757D (mm) | Chamber capacity | 310W × 320H × 330D (mm) / 30 L |
| Effective treatment area | 250W × 260D (mm) | Effective processing layers | 1–5 layers (standard: 3 layers) |
| Main power supply | 380V (±10%) AC, 50–60 Hz | Plasma power source | RF 13.56 MHz (300 W) |
| Vacuum pumping system | Direct rotary vane vacuum pump, two-stage oil pump | Control mode | PLC + HMI touchscreen (stores up to 50 recipes) |
| Operation mode | Automatic & manual (switchable) | ||
| Gas flow control | High-precision mass flow controller (0–300 ml/min) | Gas line system | Standard 1 line (O₂, N₂, Ar, CF₄, etc.) |
| Working vacuum range | 10–150 Pa | Total system power | ≤ 2 kW |
| Gas inlet pressure | O₂, N₂, Ar, CF₄: 0.4–0.5 MPa | ||
| Cooling gas (N₂) | 0.3–0.4 MPa | Compressed air (start valve) | ≥ 0.4 MPa |
| Cleaning cycle | < 5 minutes per cycle | ||
| (Vacuuming + cleaning + venting) | Notes | Actual time depends on product & process requirements |
3. Outstanding Capability in Removing Organic Contaminants
The greatest strength of the O2 Vacuum Plasma Cleaning Machine lies in its ability to remove microscopic contaminants that conventional chemical cleaning methods often fail to eliminate. The system effectively treats:
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Oils and machining lubricants: Completely removes residual oils from machining and metal stamping processes.
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Flux residues: Cleans flux contamination on PCB surfaces, ensuring electrical conductivity and aesthetic quality.
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Photoresist residues: Eliminates remaining photoresist in semiconductor and microelectronic manufacturing.
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Mold release agents: Removes silicone- or wax-based release agents from plastic parts after molding, enabling strong adhesion of subsequent coatings or adhesives.
4. When Should Companies Choose an O2 Vacuum Plasma Cleaning Machine?
Despite the availability of various surface treatment technologies, the O2 Vacuum Plasma Cleaning Machine is the preferred choice when:
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Processing heat-sensitive materials: Thin plastic films (PE, PP) or bio-films are easily deformed. This technology operates at low temperatures, preserving material integrity.
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Handling small or complex components: For electronic parts, chips, or medical devices with micro-gaps, vacuum plasma penetrates every corner.
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Requiring absolute adhesion performance: Especially critical before processes such as wire bonding or high-precision digital inkjet printing.
5. Comparison: O2 Vacuum Plasma Cleaning vs. Flame Treatment
While some manufacturers still rely on traditional flame treatment, the O2 Vacuum Plasma Cleaning Machine delivers far superior performance:
| Criteria | O2 Vacuum Plasma Cleaning Machine | Flame Treatment |
|---|---|---|
| Processing temperature | Low, safe for sensitive materials | Very high, risk of deformation or burning |
| Uniformity | Extremely high, 360° uniform treatment | Directional, prone to localized effects |
| Cleanliness | Molecular-level cleaning (removes oils) | Rough surface only, carbon residue possible |
| Process control | Precisely controlled parameters | Difficult to control, operator-dependent |
Technical Consultation
Do you need expert advice on oil or mold release removal using plasma technology?
Contact us today for professional support and free sample testing:
Ms. Yuna
📞 Hotline: +84 965 535 348
✉️ Email: sales03@cousz.com
O2 Vacuum Plasma Cleaning Machine
The O2 Vacuum Plasma Cleaning Machine delivers molecular-level cleaning and surface activation, improving adhesion and coating quality.
Product SKU: VACUUMO2E
Product Brand: COUSZ
Product Currency: VND
Product Price: 8888
Price Valid Until: 2025-12-31
Product In-Stock: InStock
admin –
Contact now for technical support!
Ms Yuna
📞 Hotline: +84 965 535 348
✉️ Email: sales03@cousz.com